Canon FPA-3000i5+ Wafer Imaging Stepper

Canon Updated: 2007-06-18
Canon FPA-3000i5+ Wafer Imaging Stepper

The FPA-3000i5+ is a high productivity mix-and-match partner with Canon excimer series scanners and steppers. Wide-field lens with extra NA variability supports a variety of fine patterning processes. This highly proven and successful veteran of the Canon stepper line-up has been a best-selling product since its release in 1996.

Features

Supports varieties of fine pattern demands. High resolution, wide-field lens, extra NA variability, plus reticle options.

High alignment accuracy for CMP processes. Two off-axis methods in addition to Canon's original technology.

High throughput features include a six-axis non-contact FLAT (Fast Linear Air-guided Tilting) stage and on-the-fly smoothing focus.

Designed for maximum contribution to low CoO and ease of operation. With common parameters for main-body structure, operation and maintenance, the FPA-3000i5+ contributes to lower CoO and ease of operation. By combining with other FPA-3000 tools such as the FPA-3000EX6 KrF stepper the i5+ delivers optimized mix and match lithography.

Semiconductor Specifications

Model type: i-Line (365nm) Stepper
Wafer size: 200mm; 150mm
Resolution: ≤0.35µm
Numerical Aperture (NA): 0.45 ~ 0.63
Reticle size: 6in. (0.25in. thick); optional 5in.
Reduction ratio: 5:1
Field size: 22mm x 22mm
Overlay accuracy: ≤ 40nm (M+3)
Throughput: ≥100wph (200mm); ≥120wph (150mm)