Canon FPA-5500iX Wafer Imaging Stepper

Canon Updated: 2007-06-18
Canon FPA-5500iX Wafer Imaging Stepper

The FPA-5500iX is a 300mm-capable stepper with the same wide field size of the FPA-3000iW and the high throughput of the FPA-5500iZ. It is recommended for CCD/LCD use as well as for rough layer IC device production in combination with higher NA Canon i-line tools and excimer scanners and steppers.

Features

Wide exposure field, high throughput for maximum production. With its newly designed 2:1 lens, the FPA-5500iX can expose a 50mm x 50mm area in a single shot. Its high-speed wafer stage design, extremely fast step and settle times, and illumination system with 4.5kW super high-pressured mercury lamp enables a throughput of 137wph on 300mm wafers and 160wph on 200mm wafers.

300mm wafer and CCD/LCD capable. Designed for integration with the FPA-5000ES4 and FPA-5000AS3 for optimal processing at either 300 or 200mm wafer size. The FPA-5000iX exposure size and high productivity supports the production of CCDs and LCDs.

Reticle SMIF and automation ready. 300mm fab automation features and options include reticle SMiF and FOUP, and in-line loading on the front, left, or right side.

Semiconductor Specifications

Model type: i-Line (365nm) Stepper
Wafer size: 300mm; 200mm
Resolution: ≤0.50µm
Numerical Aperture (NA): 0.28 ~ 0.37
Reticle size: 6in. (0.25in. thick)
Reduction ratio: 2:1
Field size: 50mm x 50mm
Overlay accuracy: ≤ 60nm (M+3)
Throughput: ≥137wph (300mm); ≥160wph ( 200mm)