Nikon NWL860TMB/TM/T IC Inspection Wafer Loader
Nikon Updated: 2008-04-14 RSSA host of top-notch features for advanced macro inspection needs
To support the latest wafer processes involving increased density, multiple layers, and progressively higher steps, this type enables various macro inspection functions including transport (micro inspection), pattern-side macro inspection, back-side center and periphery macro inspections. Users can select from three models—TMB, TM, and T—according to their needs. These models offer a variety of features, including non-contact centering controlled by photoelectric sensor to prevent contamination; a large, easy-to-read LCD control panel; and high throughput made possible by a multi-arm system that simplifies wafer loading and unloading; and support for both 150mm and 200mmø wafers.
(The photo shows an example of a wafer loader combined with an ECLIPSE L200 IC inspection microscope.)
No manuals currently available for this model.
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